| MRC |
Requirement Statement |
Characteristics |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 200.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/OPEN COLLECTOR |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CZEQ |
TIME RATING PER CHACTERISTIC |
38.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 38.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 MULTIPLEXER |
| ADAT |
BODY WIDTH |
0.280 INCHES MAXIMUM |
| CRHL |
(NON-CORE DATA) BIT QUANTITY |
4 |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
160.0 MILLIWATTS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
M0-001-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CSWJ |
(NON-CORE DATA) WORD QUANTITY |
2 |
| ADAQ |
BODY LENGTH |
0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
10 INPUT |
| ADAU |
BODY HEIGHT |
0.180 INCHES MAXIMUM |
