| MRC |
Requirement Statement |
Characteristics |
| ADAT |
BODY WIDTH |
0.265 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 4 INPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.0 VOLTS MAXIMUM POWER SOURCE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.265 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 BUFFER, NAND |
| CZEQ |
TIME RATING PER CHACTERISTIC |
80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
