| MRC |
Requirement Statement |
Characteristics |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
450.0 MILLIWATTS |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| CQZP |
INPUT CIRCUIT PATTERN |
8 INPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC |
| ADAQ |
BODY LENGTH |
0.260 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 MATRIX, GENERAL PURPOSE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| ABMK |
III OVERALL WIDTH |
0.740 INCHES MINIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.260 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
