| MRC |
Requirement Statement |
Characteristics |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQZP |
INPUT CIRCUIT PATTERN |
8 INPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
11.0 MILLIWATTS |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CQWX |
OUTPUT LOGIC FORM |
DIODE-TRANSISTOR LOGIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| TEST |
TEST DATA DOCUMENT |
37695-618999 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 GATE, NAND |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC AND HERMETICALLY SEALED AND EXPANDABLE AND BIPOLAR AND POSITIVE OUTPUTS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
1 FLAT LEADS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
35.00 NANOSECONDS NOMINAL PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
