| MRC |
Requirement Statement |
Characteristics |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
450.0 MILLIWATTS |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| CQZP |
INPUT CIRCUIT PATTERN |
8 INPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| PRMT |
III PRECIOUS MATERIAL |
GOLD |
| ADAU |
BODY HEIGHT |
0.070 INCHES MAXIMUM |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
TO-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.0 VOLTS MAXIMUM POWER SOURCE |
| PMLC |
III PRECIOUS MATERIAL AND LOCATION |
TERMINAL SURFACES GOLD |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC |
| CQWX |
OUTPUT LOGIC FORM |
DIODE LOGIC |
| ADAQ |
BODY LENGTH |
0.260 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CWSG |
TERMINAL SURFACE TREATMENT |
GOLD |
| ADAT |
BODY WIDTH |
0.260 INCHES MAXIMUM |
