| MRC |
Requirement Statement |
Characteristics |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-0.5 VOLTS MINIMUM POWER SOURCE AND 20.5 VOLTS MAXIMUM POWER SOURCE |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH VOLTAGE AND MEDIUM SPEED AND EXPANDABLE |
| ADAQ |
BODY LENGTH |
0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 COMPARATOR, MAGNITUDE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
M0-001-AE JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| TEST |
TEST DATA DOCUMENT |
96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CSWJ |
(NON-CORE DATA) WORD QUANTITY |
2 |
| ADAU |
BODY HEIGHT |
0.120 INCHES MINIMUM AND 0.160 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CRHL |
(NON-CORE DATA) BIT QUANTITY |
8 |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| CQZP |
INPUT CIRCUIT PATTERN |
11 INPUT |
