| MRC |
Requirement Statement |
Characteristics |
| CWSG |
TERMINAL SURFACE TREATMENT |
GOLD OR TIN |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MULTICHIP AND POSITIVE OUTPUTS AND NEGATIVE OUTPUTS |
| TEST |
TEST DATA DOCUMENT |
26512-GM820PS STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| PRMT |
III PRECIOUS MATERIAL |
GOLD |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC OR METAL |
| ADAQ |
BODY LENGTH |
0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| PMLC |
III PRECIOUS MATERIAL AND LOCATION |
TERMINAL SURFACE GOLD |
| CQZP |
INPUT CIRCUIT PATTERN |
1 INPUT |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| ADAU |
BODY HEIGHT |
0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
