| MRC |
Requirement Statement |
Characteristics |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
7.0 VOLTS MAXIMUM POWER SOURCE |
| CQZP |
INPUT CIRCUIT PATTERN |
12 INPUT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| ADAU |
BODY HEIGHT |
0.160 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND BIPOLAR AND PROGRAMMABLE AND W/ENABLE |
| AFGA |
OPERATING TEMP RANGE |
0.0 TO 75.0 DEG CELSIUS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| ADAQ |
BODY LENGTH |
0.882 INCHES MINIMUM AND 0.925 INCHES MAXIMUM |
| ADAT |
BODY WIDTH |
0.310 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CZEQ |
TIME RATING PER CHACTERISTIC |
40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CSWJ |
(NON-CORE DATA) WORD QUANTITY |
2048 |
| TTQY |
TERMINAL TYPE AND QUANTITY |
18 PRINTED CIRCUIT |
| CRHL |
(NON-CORE DATA) BIT QUANTITY |
8192 |
| CZER |
MEMORY DEVICE TYPE |
ROM |
