| MRC |
Requirement Statement |
Characteristics |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| TTQY |
TERMINAL TYPE AND QUANTITY |
14 FLAT LEADS |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| AFGA |
OPERATING TEMP RANGE |
0.0 TO 75.0 DEG CELSIUS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CZEQ |
TIME RATING PER CHACTERISTIC |
8.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 8.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| CBBL |
FEATURES PROVIDED |
EDGE TRIGGERED AND HERMETICALLY SEALED AND MONOLITHIC AND RESETTABLE |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-10.0 VOLTS MAXIMUM POWER SOURCE |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 FLIP-FLOP, J-K, CLOCKED |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
10 INPUT |
| CQWX |
OUTPUT LOGIC FORM |
EMITTER-COUPLED LOGIC |
