| MRC |
Requirement Statement |
Characteristics |
| ABBH |
INCLOSURE MATERIAL |
PLASTIC |
| TTQY |
TERMINAL TYPE AND QUANTITY |
8 UNINSULATED WIRE LEAD |
| FEAT |
SPECIAL FEATURES |
ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
| CTQN |
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC |
50.0 MAXIMUM WORKING PEAK REVERSE VOLTAGE, MAXIMUM PEAK TOTAL VALUE ALL SEMICONDUCTOR DEVICE DIODE |
| CTRD |
POWER RATING PER CHARACTERISTIC |
250.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION ALL SEMICONDUCTOR DEVICE DIODE |
| CTQX |
CURRENT RATING PER CHARACTERISTIC |
100.00 MILLIAMPERES MAXIMUM REVERSE CURRENT, AVERAGE ALL SEMICONDUCTOR DEVICE DIODE |
| ABMK |
OVERALL WIDTH |
0.468 INCHES MAXIMUM |
| AXGY |
MOUNTING METHOD |
TERMINAL |
| CTMZ |
SEMICONDUCTOR MATERIAL |
SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTSG |
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT |
100.0 DEG CELSIUS AMBIENT AIR |
| ASKA |
COMPONENT NAME AND QUANTITY |
4 SEMICONDUCTOR DEVICE DIODE |
| ABHP |
OVERALL LENGTH |
0.500 INCHES MAXIMUM |
| ABKW |
OVERALL HEIGHT |
0.250 INCHES MAXIMUM |
