| MRC |
Requirement Statement |
Characteristics |
| CQSJ |
INCLOSURE MATERIAL |
PLASTIC |
| ADAU |
BODY HEIGHT |
0.155 INCHES MINIMUM AND 0.200 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| ADAQ |
BODY LENGTH |
0.745 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| CRHL |
(NON-CORE DATA) BIT QUANTITY |
4 |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 COMPARATOR, MAGNITUDE |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| AFGA |
OPERATING TEMP RANGE |
-40.0 TO 85.0 DEG CELSIUS |
| CBBL |
FEATURES PROVIDED |
MEDIUM SPEED |
| ABKW |
III OVERALL HEIGHT |
0.280 INCHES MINIMUM AND 0.350 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
MO-001-AC JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQZP |
INPUT CIRCUIT PATTERN |
11 INPUT |
