MRC |
Requirement Statement |
Characteristics |
AEHX |
MAXIMUM POWER DISSIPATION RATING |
200.0 MILLIWATTS |
CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
CQZP |
INPUT CIRCUIT PATTERN |
DUAL 4 INPUT |
ADAQ |
BODY LENGTH |
0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
ADAT |
BODY WIDTH |
0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
CSSL |
DESIGN FUNCTION AND QUANTITY |
2 RECEIVER, LINE DIFFERENTIAL |
AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
CZEQ |
TIME RATING PER CHACTERISTIC |
40.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
CWSG |
TERMINAL SURFACE TREATMENT |
TIN |
ADAU |
BODY HEIGHT |
0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
T0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |