| MRC |
Requirement Statement |
Characteristics |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CQZP |
INPUT CIRCUIT PATTERN |
8 INPUT |
| ADAT |
BODY WIDTH |
0.280 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND W/CLEAR AND EDGE TRIGGERED |
| CQWX |
OUTPUT LOGIC FORM |
CURRENT INJECTION LOGIC |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
15.3 VOLTS MAXIMUM POWER SOURCE |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CZEQ |
TIME RATING PER CHACTERISTIC |
300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER |
MEMORY DEVICE TYPE |
PAL |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| ADAQ |
BODY LENGTH |
0.785 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.180 INCHES MAXIMUM |
