MRC |
Requirement Statement |
Characteristics |
TTQY |
TERMINAL TYPE AND QUANTITY |
2 BONDING PAD |
ABMK |
(NON-CORE DATA) OVERALL WIDTH |
0.050 INCHES NOMINAL |
CQWM |
NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION |
50.0 DC SINGLE SECTION |
CQJJ |
NONDERATED OPERATING TEMP |
-55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
ADAT |
BODY WIDTH |
0.050 INCHES NOMINAL |
CWJK |
CASE MATERIAL |
CERAMIC |
AARG |
RELIABILITY INDICATOR |
NOT ESTABLISHED |
ADAU |
BODY HEIGHT |
0.050 INCHES MAXIMUM |
CQLZ |
TEMP COEFFICIENT OF CAPACITANCE PER SECTION IN PPM PER DEG CELSIUS |
0.0 SINGLE SECTION |
ABKW |
(NON-CORE DATA) OVERALL HEIGHT |
0.050 INCHES MAXIMUM |
CQBQ |
CAPACITANCE VALUE PER SECTION |
3.900 PICOFARADS SINGLE SECTION |
CWSG |
III TERMINAL SURFACE TREATMENT |
SILVER |
CRTP |
TOLERANCE RANGE PER SECTION |
-0.50 TO 0.50 PICOFARADS SINGLE SECTION |
AEBZ |
SCHEMATIC DIAGRAM DESIGNATOR |
NO COMMON OR GROUNDED ELECTRODE(S) |
ADAQ |
BODY LENGTH |
0.095 INCHES NOMINAL |
CWPM |
DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT |
0.1000 |
AAQL |
BODY STYLE |
CHIP TYPE |
ABHP |
(NON-CORE DATA) OVERALL LENGTH |
0.095 INCHES NOMINAL |
CWPK |
INSULATION RESISTANCE AT REFERENCE TEMP |
100000.0 MEGOHMS |
CRHD |
TOLERANCE OF TEMP COEFFICIENT PER SECTION IN PPM PER DEG CELSIUS |
-25.0 TO 25.0 SINGLE SECTION |