| MRC |
Requirement Statement |
Characteristics |
| CQSJ |
INCLOSURE MATERIAL |
PLASTIC |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
200.0 MILLIWATTS |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CBBL |
FEATURES PROVIDED |
DYNAMIC AND STATIC OPERATION AND LOW POWER AND POSITIVE OUTPUTS |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 4 INPUT |
| ADAQ |
BODY LENGTH |
0.745 INCHES MINIMUM AND 0.770 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEQ |
TIME RATING PER CHACTERISTIC |
300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFGA |
OPERATING TEMP RANGE |
-40.0 TO 85.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 GATE, NOR |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.180 INCHES MAXIMUM |
