| MRC |
Requirement Statement |
Characteristics |
| CQSJ |
INCLOSURE MATERIAL |
PLASTIC |
| CQZP |
INPUT CIRCUIT PATTERN |
12 INPUT |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CSWJ |
(NON-CORE DATA) WORD QUANTITY |
1024 |
| CBBL |
FEATURES PROVIDED |
BIDIRECTIONAL AND LOW POWER AND HERMETICALLY SEALED AND PROGRAMMED AND 3-STATE OUTPUT |
| ADAU |
BODY HEIGHT |
0.139 INCHES MINIMUM AND 0.149 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-0.0 TO 70.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.251 INCHES MINIMUM AND 0.261 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.0 VOLTS MAXIMUM POWER SOURCE |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CRHL |
(NON-CORE DATA) BIT QUANTITY |
4096 |
| ADAQ |
BODY LENGTH |
0.890 INCHES MINIMUM AND 0.910 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
18 PRINTED CIRCUIT |
| CZER |
MEMORY DEVICE TYPE |
RAM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
250.0 MILLIWATTS |
