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5962-01-088-4261, 5962010884261 NSN Information

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Manufacturer Part Number(s):115294-0003, 1820-1081, 308800-2, 3178338-1, 51NW9615B35, 725000-103, 725000-590, 725000-987, 8T26A/BEA, 917AS6064, AM8T26ADMB, DST26AMJ883B

FSC NIIN ITEM NAME
5962 010884261 MICROCIRCUIT,DIGITAL
INC ESDC HMIC
3177 D N

5962-01-088-4261 MCRD (Master Cross Reference Data)

Mfg. Part # Mfg. Name CAGE RNCC RNVC ISC MSDS SADC DAC HCC
115294-0003 THALES ATM INC. 65597 C 1 1 T
1820-1081 HEWLETT PACKARD CO 28480 C 1 1 N
308800-2 NORTHROP GRUMMAN SYSTEMS CORPORATION 15280 C 1 1 D
3178338-1 RAYTHEON COMPANY 05869 C 1 1 N
51NW9615B35 FREESCALE SEMICONDUCTOR INC. 04713 C 1 1 D
725000-103 RAYTHEON COMPANY 05869 5 9 1
725000-590 RAYTHEON COMPANY 05869 C 1 1 F
725000-987 RAYTHEON COMPANY 05869 5 2 1
8T26A/BEA PHILIPS SEMICONDUCTORS INC 18324 5 2 1
917AS6064 NAVAL AIR SYSTEMS COMMAND 30003 C 1 1 N
AM8T26ADMB ADVANCED MICRO DEVICES, INC. 34335 C 1 1 N
DST26AMJ883B NATIONAL SEMICONDUCTOR CORPORATION 27014 C 1 1 T
MC6880L FREESCALE SEMICONDUCTOR INC. 04713 C 1 1 D
MC8T26A FREESCALE SEMICONDUCTOR INC. 04713 C 1 1 F
N8T26F-B ADVANCED MICRO DEVICES, INC. 34335 5 9 1
RB8T26F PHILIPS SEMICONDUCTORS INC 18324 C 1 1 D
S8T26AF/883B PHILIPS SEMICONDUCTORS INC 18324 5 9 1
S8T26AF/883C PHILIPS SEMICONDUCTORS INC 18324 C 1 1 A
S8T26AF/883E PHILIPS SEMICONDUCTORS INC 18324 C 1 1 D
S8T26AFB ADVANCED MICRO DEVICES, INC. 34335 5 9 1
S8T26F-B ADVANCED MICRO DEVICES, INC. 34335 C 1 1 F
S8T26F/883B PHILIPS SEMICONDUCTORS INC 18324 C 1 1 D
S8T26F/883B ADVANCED MICRO DEVICES, INC. 34335 C 1 1 N
SM-A-942691 US ARMY COMMUNICATIONS & 80063 3 2 1
SM-A-942691 FREESCALE SEMICONDUCTOR INC. 04713 5 2 1

5962-01-088-4261 Characteristics

MRC Requirement Statement Characteristics
CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
AGAV III END ITEM IDENTIFICATION TRANSMITTING SET,RADAR DATA TYPE AN/AKT-18
TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
CQZP INPUT CIRCUIT PATTERN 6 INPUT
AEHX MAXIMUM POWER DISSIPATION RATING 457.0 MILLIWATTS
CWSG TERMINAL SURFACE TREATMENT SOLDER
CSSL DESIGN FUNCTION AND QUANTITY 4 TRANSCEIVER
TEST TEST DATA DOCUMENT 80063-SM-A-942691 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
CZEQ TIME RATING PER CHACTERISTIC 14.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 14.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
AFGA OPERATING TEMP RANGE -55.0 TO 125.0 DEG CELSIUS
CQSJ INCLOSURE MATERIAL CERAMIC AND GLASS
CBBL FEATURES PROVIDED HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND SCHOTTKY AND 3-STATE OUTPUT
AFJQ STORAGE TEMP RANGE -65.0 TO 150.0 DEG CELSIUS
ADAU BODY HEIGHT 0.140 INCHES MINIMUM AND 0.160 INCHES MAXIMUM
ADAQ BODY LENGTH 0.750 INCHES MINIMUM AND 0.780 INCHES MAXIMUM
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 5.5 VOLTS MAXIMUM POWER SOURCE
ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM