| MRC |
Requirement Statement |
Characteristics |
| ADAT |
BODY WIDTH |
0.120 INCHES MINIMUM AND 0.200 INCHES MAXIMUM |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| ADAQ |
BODY LENGTH |
0.280 INCHES MAXIMUM |
| CQZP |
INPUT CIRCUIT PATTERN |
6 INPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND HIGH SPEED AND POSITIVE OUTPUTS |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| AGAV |
III END ITEM IDENTIFICATION |
F-15 A/C AN/ALQ 128 |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
268.0 MILLIWATTS |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
F-3 MIL-M-38510 |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| CZEQ |
TIME RATING PER CHACTERISTIC |
115.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 115.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
