MRC |
Requirement Statement |
Characteristics |
CSSL |
DESIGN FUNCTION AND QUANTITY |
1 COUNTER, BINARY CODED DECIMAL |
CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
TEST |
TEST DATA DOCUMENT |
99971-7537026 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
TTQY |
TERMINAL TYPE AND QUANTITY |
16 FLAT LEADS |
CRHL |
(NON-CORE DATA) BIT QUANTITY |
4 |
CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
ADAQ |
BODY LENGTH |
0.371 INCHES MINIMUM AND 0.409 INCHES MAXIMUM |
CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC AND POSITIVE OUTPUTS AND PRESETTABLE AND RESETTABLE AND SYNCHRONOUS AND ASYNCHRONOUS |
CZEQ |
TIME RATING PER CHACTERISTIC |
35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
ADAU |
BODY HEIGHT |
0.050 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
CQZP |
INPUT CIRCUIT PATTERN |
9 INPUT |
ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.283 INCHES MAXIMUM |
AEHX |
MAXIMUM POWER DISSIPATION RATING |
325.0 MILLIWATTS |