| MRC |
Requirement Statement |
Characteristics |
| ADAQ |
BODY LENGTH |
0.405 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
24 FLAT LEADS |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 REGISTER, VOLTAGE, COMPLEMENTARY |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
-32.0 VOLTS MAXIMUM POWER SOURCE AND 0.3 VOLTS MAXIMUM POWER SOURCE |
| ADAT |
BODY WIDTH |
0.280 INCHES MAXIMUM |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| ADAU |
BODY HEIGHT |
0.070 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CZEQ |
TIME RATING PER CHACTERISTIC |
700.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 700.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQZP |
INPUT CIRCUIT PATTERN |
16 INPUT |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
180.0 MILLIWATTS |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
