| MRC |
Requirement Statement |
Characteristics |
| CSWJ |
(NON-CORE DATA) WORD QUANTITY |
1 |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND W/ENABLE AND SYNCHRONOUS AND W/STROBE AND HIGH SPEED AND POSITIVE OUTPUTS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
18.0 VOLTS MAXIMUM POWER SOURCE |
| CQZP |
INPUT CIRCUIT PATTERN |
14 INPUT |
| AFGA |
OPERATING TEMP RANGE |
-0.0 TO 70.0 DEG CELSIUS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 MICROPROCESSOR |
| ADAT |
BODY WIDTH |
0.500 INCHES NOMINAL |
| CRHL |
(NON-CORE DATA) BIT QUANTITY |
16 |
| AFJQ |
STORAGE TEMP RANGE |
-55.0 TO 150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| ADAQ |
BODY LENGTH |
1.970 INCHES NOMINAL |
| CQWX |
OUTPUT LOGIC FORM |
N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAU |
BODY HEIGHT |
0.070 INCHES NOMINAL |
| CZEQ |
TIME RATING PER CHACTERISTIC |
400.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| TTQY |
TERMINAL TYPE AND QUANTITY |
40 PRINTED CIRCUIT |
