| MRC |
Requirement Statement |
Characteristics |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
800.0 MILLIWATTS |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND HIGH VOLTAGE AND MEDIUM SPEED |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| ADAT |
BODY WIDTH |
0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.130 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
2 DRIVER, PERIPHERAL |
| CQZP |
INPUT CIRCUIT PATTERN |
DUAL 2 INPUT |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| ADAQ |
BODY LENGTH |
0.340 INCHES MINIMUM AND 0.390 INCHES MAXIMUM |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ |
TIME RATING PER CHACTERISTIC |
65.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
| TTQY |
TERMINAL TYPE AND QUANTITY |
8 PRINTED CIRCUIT |
