| MRC |
Requirement Statement |
Characteristics |
| CQSZ |
INCLOSURE CONFIGURATION |
CAN |
| CQZP |
INPUT CIRCUIT PATTERN |
2 INPUT |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
TO-5 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| ABKW |
III OVERALL HEIGHT |
0.685 INCHES NOMINAL |
| CQSJ |
INCLOSURE MATERIAL |
METAL |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| ADAR |
BODY OUTSIDE DIAMETER |
0.350 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
570.0 MILLIWATTS |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND LOW CURRENT AND POSITIVE OUTPUTS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 AMPLIFIER, OPERATIONAL, GENERAL PURPOSE |
| ADAU |
BODY HEIGHT |
0.165 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AFGA |
OPERATING TEMP RANGE |
0.0 TO 70.0 DEG CELSIUS |
