| MRC |
Requirement Statement |
Characteristics |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 PRINTED CIRCUIT |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
70.0 MILLIWATTS |
| CQZP |
INPUT CIRCUIT PATTERN |
4 INPUT |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CQWX |
OUTPUT LOGIC FORM |
COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAU |
BODY HEIGHT |
0.160 INCHES MINIMUM AND 0.180 INCHES MAXIMUM |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND AC COUPLED AND DC COUPLED AND LOW POWER AND MONOLITHIC AND SYNCHRONOUS AND W/BUFFERED OUTPUT AND W/DISABLE AND W/ENABLE |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
1 PHASE LOCKED LOOP |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
18.5 VOLTS MAXIMUM POWER SOURCE |
| ADAQ |
BODY LENGTH |
0.750 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
