| MRC |
Requirement Statement |
Characteristics |
| CQWX |
OUTPUT LOGIC FORM |
P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| ADAT |
BODY WIDTH |
0.520 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| ADAQ |
BODY LENGTH |
1.300 INCHES MINIMUM AND 1.500 INCHES MAXIMUM |
| TTQY |
TERMINAL TYPE AND QUANTITY |
28 PRINTED CIRCUIT |
| CQSZ |
INCLOSURE CONFIGURATION |
DUAL-IN-LINE |
| AFGA |
OPERATING TEMP RANGE |
-0.0 TO 70.0 DEG CELSIUS |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| AFJQ |
STORAGE TEMP RANGE |
-55.0 TO 150.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| CQZP |
INPUT CIRCUIT PATTERN |
19 INPUT |
| ADAU |
BODY HEIGHT |
0.200 INCHES MAXIMUM |
| TEST |
TEST DATA DOCUMENT |
26916-058-002040 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/STROBE AND W/ENABLE AND W/STORAGE AND ASYNCHRONOUS AND SYNCHRONOUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
500.0 MILLIWATTS |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
0.3 VOLTS MAXIMUM POWER SOURCE |
