| MRC |
Requirement Statement |
Characteristics |
| CBBL |
FEATURES PROVIDED |
MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND HIGH SPEED |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CQZP |
INPUT CIRCUIT PATTERN |
TRIPLE 3 INPUT |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
3 GATE, NAND |
| TEST |
TEST DATA DOCUMENT |
05869-717310-97 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| CZEQ |
TIME RATING PER CHACTERISTIC |
10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| ADAQ |
BODY LENGTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAT |
BODY WIDTH |
0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM |
| ADAU |
BODY HEIGHT |
0.030 INCHES MINIMUM AND 0.060 INCHES MAXIMUM |
| AFGA |
OPERATING TEMP RANGE |
0.0 TO 70.0 DEG CELSIUS |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
30.0 MILLIWATTS |
