| MRC |
Requirement Statement |
Characteristics |
| CBBL |
FEATURES PROVIDED |
HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND 3-STATE OUTPUT AND W/ENABLE |
| AEHX |
MAXIMUM POWER DISSIPATION RATING |
275.0 MILLIWATTS |
| CQWX |
OUTPUT LOGIC FORM |
TRANSISTOR-TRANSISTOR LOGIC |
| CQZP |
INPUT CIRCUIT PATTERN |
8 INPUT |
| CQSZ |
INCLOSURE CONFIGURATION |
FLAT PACK |
| TTQY |
TERMINAL TYPE AND QUANTITY |
16 FLAT LEADS |
| ADAQ |
BODY LENGTH |
0.371 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
| CTFT |
CASE OUTLINE SOURCE AND DESIGNATOR |
M0-004-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CWSG |
TERMINAL SURFACE TREATMENT |
SOLDER |
| CZEQ |
TIME RATING PER CHACTERISTIC |
21.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 27.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| TEST |
TEST DATA DOCUMENT |
03640-6088916 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| AFGA |
OPERATING TEMP RANGE |
-55.0 TO 125.0 DEG CELSIUS |
| CQSJ |
INCLOSURE MATERIAL |
CERAMIC AND GLASS |
| AFJQ |
STORAGE TEMP RANGE |
-65.0 TO 150.0 DEG CELSIUS |
| ADAU |
BODY HEIGHT |
0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| CZEN |
VOLTAGE RATING AND TYPE PER CHARACTERISTIC |
5.5 VOLTS MAXIMUM POWER SOURCE |
| AGAV |
III END ITEM IDENTIFICATION |
COUNTERMEASURES SET TYPE AN/ALQ-99E(V) |
| CSSL |
DESIGN FUNCTION AND QUANTITY |
6 DRIVER, BUS |
| ADAT |
BODY WIDTH |
0.247 INCHES MINIMUM AND 0.285 INCHES MAXIMUM |
